Knowledge Sharing & Insights

PCB & Electronics Blog

Here I share insights from my more than 30 years of experience in printed circuit board design, PCB layout, and electronics development. Gain actionable tips to optimize your design and eliminate costly errors.

October 9, 2026
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Production-ready PCB layout without costly errors

A production-ready PCB layout demands rigorous control over stackup, impedance, EMC, thermal management, and documentation. Mitigate risks before pilot production and empirical testing.

October 7, 2026
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PCB design review checklist for critical boards

Use this PCB design review checklist to detect flaws in signal integrity, EMC, PDN, thermal performance, and manufacturing before releasing the board to fabrication, preventing costly respins.

October 6, 2026
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Blind and buried vias in PCBs – when are they used?

Blind and buried vias in PCBs recover routing area but require precise stackup, DFM rules, and test strategies to ensure high yield and stable manufacturing.

October 5, 2026
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When are HDI PCBs used in practice?

When are HDI PCBs used? Review the technical criteria for dense routing, high signal speeds, EMC, thermal dissipation, manufacturing, and realistic cost drivers in practice.

October 4, 2026
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PCB impedance calculation without guesswork

Accurate PCB impedance calculation safeguards signal integrity, EMC compliance, and manufacturability. See which parameters, tolerances, and design choices determine practical outcomes.

October 3, 2026
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What is controlled impedance on a PCB?

What is controlled impedance? Master stackup design, trace geometry, and fabrication parameters so high-speed and RF signals preserve signal integrity in mission-critical PCBs.

October 2, 2026
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Power integrity analysis before layout freeze

A power integrity analysis identifies PDN resonances, IR drop, and ripple before they manifest as EMC failures, erratic operation, or costly board respins in production.

October 1, 2026
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Signal integrity analysis before layout failure

A signal integrity analysis reveals reflections, jitter, and compromised return paths early, ensuring high-speed PCBs are designed, validated, and manufactured correctly the first time.

September 30, 2026
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EMC optimization of PCBs in complex designs

PCB EMC optimization mitigates noise, test failures, and project delays. Learn how stackup architecture, return paths, PDN, and layout decisions reinforce a production-ready design.

September 29, 2026
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RF PCB design that maintains signal stability

RF PCB design requires more than short traces. Master stackup, impedance, return paths, decoupling, and EMC before the layout turns into costly troubleshooting on the production line.

September 28, 2026
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High-speed PCB design requires control from the start

High-speed PCB design requires controlled impedance, a robust PDN, and early EMC control to ensure complex hardware performs reliably in production.

September 27, 2026
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External PCB designer for complex hardware projects

An external PCB designer delivers senior expertise in high-speed, RF, HDI, and EMC when the layout must be production-ready and work right the first time in the field.